Call for Papers

The World Cyberspace Cooperation Summit is a unique event that convenes experts, stakeholders and decision-makers from industry, government and academia to advance international policy to promote the security, stability and safety of cyberspace. As with the first three, this Summit is sponsored by the EastWest Institute, in partnership with the technical co-sponsor, the IEEE.

Consistent with EWI’s reputation as a “think-and-do tank,” the Summit fosters problem solving and solution recommendations for difficult international and consequential policy gaps in cyberspace, i.e. the internationally-focused Agreements, Standards, Policies and Regulations (ASPR) gaps. Ultimately, the Summit’s format tackles the issues of mistrust and the confidence building necessary for global cooperation. The Summit prefers papers focused on ASPR gaps rather than strictly technology focused papers.

Papers are sought for international policy-related aspects of cybersecurity, including (but not limited to):

  • Worldwide governance, frameworks and protocols for the day-to-day behavior, in cyberspace, policing cyberspace and the conduct of cyber conflict.
  • Worldwide strategies and mechanisms for the reliability and resilience of the supply chain, infrastructure and emerging capabilities (e.g., the mobile ecosystem).
  • Worldwide response strategies and mechanisms to cyber crisis (e.g., international priority communications, and trusted information sharing).
  • Worldwide issues, awareness and education (e.g., protecting youth, spam and the private public partnerships need to secure the global economy).
  • Legal aspects: Digital Divide and Accessibility; digital (e-) issues for government, privacy, identity, fraud, punishment, jurisdictions, etc.
  • International social networking and on-line communities: commercial development, commercialization, norms, data protection, EULAs, emergency response, etc.
  • New trends in cyberspace: optimizing  policy for secure cloud enablement; emergency preparedness; cyber instability; economic and innovation impact of securing cyberspace; asymmetrical acts of aggression; eGovernment services in the context of digital society; eCommerce and eBusiness; and eDefense for security and protection.

 

SUBMISSION REQUIREMENTS:

  • Contents must be original work
  • Length of 4-6 pages
  • Format per IEEE conference style (see below for templates and guidelines)
  • Cover page must clearly indicate the complete contact information for the author: email, postal address and phone number
  • Submissions must be made in PDF format here: EWI-CyberSummit-ASPR@sei.cmu.edu

 

KEY DATES

Rolling > Full Paper Submissions (Submit early to ensure timely notification)

1 October 2013 > Final Acceptance Notifications

21 October > Poster PDF ready for approval (and printing for non-U.S. submissions)

29 November 2013 > Camera-ready Final Paper Submission Due

Submission of an abstract implies the willingness of at least one of the authors to present a complete and final version of the paper at the Summit in Silicon Valley (unless advanced permission granted). Authors agree to advance release of papers to selected media outlets. Authors of selected papers, will have the session, and have their papers submitted for inclusion into IEEE Xplore, and submitted to various A&I databases, with the exception that EWI and IEEE reserve the right to exclude any paper from distribution after the conference if the paper is not presented at the conference. Non-presented papers are not submitted for inclusion to IEEE Xplore or any A&I databases.

 

ASPR PROGRAM COMMITTEE CO-CHAIRS 

North America: Dr. Greg Shannon, Carnegie Mellon University

Europe: Dr. Sandro Gaycken, Freie Universität Berlin

Asia: Dr. Richard Zhao, NSFOCUS Information Technology Co., Ltd

 

REVIEWERS

Dr. Greg Austin, EastWest Institute

Dr. Sandro Gaycken, Freie Universität Berlin

Catherine Lotrionte, Georgetown University

John Savage, Brown University

Melissa Sordyl, Westover Group 

Gang Tian, Lehigh University  

Dr. Richard Zhao, NSFOCUS Information Technology Co., Ltd

 

MORE INFORMATION

Template & guidelines

Previous submissions

Sample Poster

IEEE Xplore